{"id":6805,"date":"2026-03-11T09:10:45","date_gmt":"2026-03-11T01:10:45","guid":{"rendered":"https:\/\/microcosmtech.com\/?p=6805"},"modified":"2026-03-18T10:01:49","modified_gmt":"2026-03-18T02:01:49","slug":"n-pspi-photosensitive-dielectric-material","status":"publish","type":"post","link":"https:\/\/microcosm.com.cn\/zh_cn\/n-pspi-photosensitive-dielectric-material\/","title":{"rendered":"N-PSPI Photosensitive Dielectric Material"},"content":{"rendered":"

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N-PSPI Photosensitive Dielectric Material<\/b><\/span><\/span><\/h2><\/div>

A Key Dielectric Layer Solution for RDL Processes
\nHigh resolution, high taper angle, and high reliabilityDelivering the optimal dielectric material for advanced packaging
\nMeeting the process of 2.5D \/ 3D packaging and PLP applications
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Contact Us<\/span><\/a><\/div><\/div><\/div><\/div><\/div>
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High-Resolution Photosensitive Material for RDL Redistribution Layers<\/b><\/span><\/span><\/h2><\/div>

N-PSPI Photosensitive Dielectric Material\u00a0<\/span><\/strong>is a high-performance photosensitive dielectric material specifically developed for RDL<\/strong>\uff08Redistribution Layer\uff09processes.<\/strong> It features excellent imaging resolution, low curing temperature, high taper-angle via profiles, and outstanding dielectric properties.<\/strong><\/p>\n

N-PSPI enables direct photolithographic patterning<\/strong> of fine structures and is widely applied in WLP, PLP, and other advanced packaging architectures<\/strong>.<\/p>\n

With its high resolution and low CTE characteristics, N-PSPI provides an optimal dielectric solution for high-speed, high-frequency, and high-reliability semiconductor packaging.<\/span><\/p>\n<\/div><\/div><\/div>

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Common Challenges and Limitations<\/b><\/span><\/span><\/h2><\/div><\/div><\/div>

Modern advanced packaging technologies – such as 2.5D \/ 3D IC, AI\/HBM, and PLP packaging – place increasingly stringent requirements on RDL dielectric materials:<\/p>\n<\/div>

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  • Fine line widths and via dimensions<\/li>\n
  • Lower dielectric loss<\/li>\n
  • Higher taper angles for reliable metal filling<\/li>\n
  • Lower CTE and improved material stability<\/li>\n<\/ul>\n<\/div>

    Microcosm N-PSPI Photosensitive Dielectric Material is specifically engineered to address the challenges of advanced packaging.<\/p>\n<\/div><\/div><\/div><\/div><\/div>

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    Product Advantages<\/b><\/span><\/span><\/h2><\/div>\n
    \n\n\n\n\n\n\n\n\n\n\n\n
    Feature<\/th>\nDescription<\/th>\nProduct Values<\/th>\n<\/tr>\n<\/thead>\n
    High Resolution<\/span><\/td>\n5\/10\u300110\/10 \u03bcm<\/span><\/td>\nImproves precision of fine RDL routing; supports high-density packaging and high-speed chip designs<\/span><\/td>\n<\/tr>\n
    Low-Temperature Curing<\/span><\/td>\n200\u00b0C<\/span><\/td>\nCompatible with PLP packaging and temperature-sensitive substrates; increases process flexibility<\/span><\/td>\n<\/tr>\n
    High Taper Angle<\/span><\/td>\n86.1\u00b0\uff5e86.9\u00b0<\/span><\/td>\nEnables smoother metal via filling, reduces via failure, and improves overall yield<\/span><\/td>\n<\/tr>\n
    \u00a0Low CTE<\/span><\/td>\n17 ppm\/\u00b0C\u300137 ppm\/\u00b0C<\/span><\/td>\nReduces thermal stress, effectively minimizing package warpage and interconnect fatigue<\/span><\/td>\n<\/tr>\n
    Excellent Thermal Stability<\/span><\/td>\nTd5% = 332\u00b0C<\/span><\/td>\nWithstands high temperatures in downstream plating, reflow, and packaging processes<\/span><\/td>\n<\/tr>\n
    Superior dielectric properties<\/span><\/td>\nDk = 3.3<\/span><\/td>\nEnsures more stable high-frequency, high-speed signal transmission with lower signal loss<\/span><\/td>\n<\/tr>\n
    Outstanding mechanical properties<\/span><\/td>\nTensile strength 110 MPa\u3001elongation 31%<\/span><\/td>\nEnhances structural stability of the package and improves long-term reliability<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div><\/div>
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    Why Choose Us?
    \n<\/b><\/span><\/span>See the Product Comparison <\/b><\/span><\/span><\/p><\/h2><\/div>\n
    \n\n\n\n\n\n\n\n\n\n\n
    Performance Metric<\/span><\/th>\nMicrocosm N-PSPI<\/strong><\/th>\nGeneral PI<\/strong><\/th>\nGeneral Photosensitive Materials<\/strong><\/th>\n<\/tr>\n<\/thead>\n
    Curing Temperature<\/span><\/td>\n200\u00b0C\uff08Low-Temp.\uff09<\/span><\/strong><\/td>\n350\u00b0C\u2191<\/span><\/td>\n230\u2013260\u00b0C<\/span><\/td>\n<\/tr>\n
    Resolution<\/span><\/td>\n5\/10 \u03bcm<\/strong><\/span><\/td>\n10\/20 \u03bcm<\/span><\/td>\n7\/15 \u03bcm<\/span><\/td>\n<\/tr>\n
    Taper Angle<\/span><\/td>\n> 86\u00b0<\/span><\/strong><\/td>\n70\u201375\u00b0<\/span><\/td>\n78\u201382\u00b0<\/span><\/td>\n<\/tr>\n
    CTE<\/span><\/td>\n17 \/ 37 ppm\/\u00b0C\uff08Low\uff09<\/span><\/strong><\/td>\n40\u201360 ppm<\/span><\/td>\n50 ppm\u2191<\/span><\/td>\n<\/tr>\n
    Decomposition Temp.<\/span><\/td>\n332\u00b0C<\/span><\/strong><\/td>\n300\u00b0C<\/span><\/td>\n310\u00b0C<\/span><\/td>\n<\/tr>\n
    Dk<\/span><\/td>\n3.3\uff08Excellent\uff09<\/span><\/strong><\/td>\n3.5\u20133.8<\/span><\/td>\n\u2265 3.7<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div><\/div>
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    The Optimal Solution<\/b><\/span><\/span><\/h2><\/div><\/div><\/div>

    N-PSPI Photosensitive Dielectric Material significantly outperforms conventional materials in resolution, sharp taper angle, and low CTE<\/strong>, making it the ideal dielectric layer for high-density, high-reliability RDL applications<\/strong>.<\/p>\n<\/div><\/div><\/div><\/div><\/div>

    Product Application Structure<\/b><\/span><\/span><\/h2><\/div>
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      RDL Redistribution Layer Application Structure Diagram<\/span><\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/article>\n<\/div>\n<\/li>\n<\/ul>\n<\/div>

      \"N-PSPI<\/span><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":6334,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[226],"tags":[],"class_list":["post-6805","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-scmaterials-en"],"acf":[],"_links":{"self":[{"href":"https:\/\/microcosm.com.cn\/zh_cn\/wp-json\/wp\/v2\/posts\/6805","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/microcosm.com.cn\/zh_cn\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/microcosm.com.cn\/zh_cn\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/microcosm.com.cn\/zh_cn\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/microcosm.com.cn\/zh_cn\/wp-json\/wp\/v2\/comments?post=6805"}],"version-history":[{"count":29,"href":"https:\/\/microcosm.com.cn\/zh_cn\/wp-json\/wp\/v2\/posts\/6805\/revisions"}],"predecessor-version":[{"id":8255,"href":"https:\/\/microcosm.com.cn\/zh_cn\/wp-json\/wp\/v2\/posts\/6805\/revisions\/8255"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/microcosm.com.cn\/zh_cn\/wp-json\/wp\/v2\/media\/6334"}],"wp:attachment":[{"href":"https:\/\/microcosm.com.cn\/zh_cn\/wp-json\/wp\/v2\/media?parent=6805"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/microcosm.com.cn\/zh_cn\/wp-json\/wp\/v2\/categories?post=6805"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/microcosm.com.cn\/zh_cn\/wp-json\/wp\/v2\/tags?post=6805"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}